The issue with break out is the thickness of the board. Did you ever think of doing it differently, suchas making a thinner board and snapping something on to create the thickness? It may also have an inpact on the cost of the overall bard.
As I understand from this process is, that after the Picos have been tested, the milling will happen to cut off the utility connections - is that correct?
Espruino is a JavaScript interpreter for low-power Microcontrollers. This site is both a support community for Espruino and a place to share what you are working on.
The issue with break out is the thickness of the board. Did you ever think of doing it differently, suchas making a thinner board and snapping something on to create the thickness? It may also have an inpact on the cost of the overall bard.
As I understand from this process is, that after the Picos have been tested, the milling will happen to cut off the utility connections - is that correct?