• Still very much usable, but it's not really saleable, and I'd been hoping to put a few up on ebay or tindie to see how they sell. It only impacts the TSSOP-28 area further from the edge (you can see the missing trace in the picture above), and it can still be used for smaller parts, or for SOIC parts.

    Also, I need to modify the MSOP area so that you can use a DFN part on it; I think the spacing is right, or close enough that I could do what I did for 5050 LED / SOT-23-6

    I think I want to thin the "line" in the solder mask over the exposed Vcc traces, so they have a bit of mask on the edges, so you can clearly see which trace is Vcc

    Need to do bottom silk screen too, as noted previously.

    I really like the yellow solder mask - you can see the traces so clearly.

    Also - the test results of making thin easily bridgable pads - no luck. To make them bridge, you just have to pile on solder, even if there's no mask between them. At least that settles the question.

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