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@DrAzzy
My thinking so far is for most of the surface to be stripes of two rows of 3 or 4-hole, each on either side of of SOIC pads (probably SOIC-16's, since 2 of those are an SOIC-8).
Note the extra pad at the end of the rows of 4 - that's an SMD pad... though maybe I should omit that, and just rely on the normal spacing, and let the SMD cover part of the last hole. I'll need to do a few mockups this weekend with printout.
There's also the question of whether to expose the copper between each hole in a row, and even whether to put that copper between the holes in a row on both sides, or only on one side - I think a trace could be squeezed between them - maybe for routing SPI or I2C? But maybe that wouldn't be a good place to route data lines. It would probably make sense to have some areas at least where there's 3 wires (SPI or I2C + spare) with multiple taps on it, near the IC area.
My plan is for there to be a hole for most, if not all pins - I don't want to make many assumptions about what specific part is going in any place, except for the most common-of-common (like a pile of SOT-23 with the sources all on ground or something).
I was thinking I need some spots with SOT-23-6 pads, maybe some of those weird SM-8 packages, thjat look like SOIC, only a bit smaller (I have a few parts in that).
Re: that red board - when was the last time you wanted to solder down something with pins on 4 sides, and it was something that would be sensible to slap onto protoboard? Sure, there are a million and one lovely sensors and stuff, but not in packages that you can really hand-solder onto protoboard.
I agree on some 2mm pitch near the edge for interfacing.