• Very few components like to be bent and stretched like that. Even solder joints can crack with repeated stress. Relying on the IC package for structural supports seems to me a bit backwards. I guess it's good for prototyping wearables, though I presume the project would die rather quickly.

    Do you have experience using this? :)

    EDIT: What's the progress on this @DrAzzy? Did you pull the trigger?

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